# US 2015/0091031 A1 · Locating optical structures to leds

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- Number: US 2015/0091031 A1
- Document ID: US20150091031A1
- Status: Published application
- Kind: A1
- Application number: 14/041,874
- Filed: 2013-09-30
- Published: 2015-04-02
- Earliest claimed: 2013-09-30
- Assignees: Goodrich Corporation
- Applicants: Goodrich Corporation
- Inventors: Gerald B. Biehle
- Web page: https://patentgrep.com/patent/US20150091031A1

## CPC

- H10H 20/8506: {Containers}
- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- H05K 1/181: associated with surface mounted components
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2201/10113: Lamp
- H05K 2201/10121: Optical component, e.g. opto-electronic component
- H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
- H10H 20/036: {of packages}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An optical device and a method of making an optical device are disclosed. A printed wiring board is formed that includes coupling elements at selected locations. The coupling elements are formed using a printed wiring board manufacturing technique. A light source may be coupled to the printed wiring board at one of the coupling elements. An optical structure for directing light from the light source may be coupled to the printed wiring board at another coupling element. A tolerance for a distance between the optical structure and the light source is thus controlled using the manufacturing technique.

## Claims

### Claim 1

A method of making an optical device, comprising:
forming coupling elements at selected locations on a printed wiring board using a printed wiring board manufacturing technique;
coupling a light source to the printed wiring board at one of the coupling elements; and
coupling an optical structure to the printed wiring board at another of the coupling elements at a selected distance to the light source, wherein a tolerance for the selected distance is controlled using the printed wiring board manufacturing technique.

### Claim 2 (depends on 1)

The method of claim 1, wherein a selected coupling element further comprises a solder pad and wherein coupling one of the light source and the optical structure to the printed wiring board further comprises soldering the one of the light source and the optical structure to the printed wiring board at the solder pad.

### Claim 3 (depends on 2)

The method of claim 2 further comprising applying a selected volume of solder between the one of the optical structure and the light source and the solder pad to provide self-centering of the one of the optical structure and the light source during a soldering process.

### Claim 4 (depends on 1)

The method of claim 1, wherein a selected coupling element further comprises a hole, the method further comprising securing the printed wiring board to a part that includes the optical structure by aligning the hole of the printed wiring board with a hole in the part.

### Claim 5 (depends on 1)

The method of claim 1, wherein the printed wiring board manufacturing technique further comprises at least one of: a lithographic technique; a photoetching technique; a plating technique; and a technique used in semiconductor fabrication.

### Claim 6 (depends on 1)

The method of claim 1 wherein the light source is a light emitting diode.

### Claim 7 (depends on 1)

The method of claim 1, wherein the optical structure is at least one: of a reflective surface; a light shield; and a lens.

### Claim 8

An optical device, comprising:
a printed wiring board having a first coupling element and a second coupling element formed thereon using a printed wiring board manufacture technique;
a light source coupled to the printed wiring board at the first coupling element; and
an optical structure coupled to the printed wiring board at the second coupling element, wherein a tolerance of a distance between the optical structure and the light source is controlled via the manufacturing technique.

### Claim 9 (depends on 8)

The optical device of claim 8, wherein at least one of the first coupling element and the second coupling element comprises a solder pad.

### Claim 10 (depends on 9)

The optical device of claim 9 further comprising solder between the solder pad and the one of the optical structure and the light source, wherein a volume of the solder is selected to provide self-centering of the one of the optical structure and the light source during the soldering process.

### Claim 11 (depends on 8)

The optical device of claim 8, wherein the coupling element further comprises a hole and the printed wiring board is secured to a part that includes the optical structure by alignment of the hole of the printed wiring board with a hole in the part.

### Claim 12 (depends on 8)

The optical device of claim 8, wherein the manufacturing technique of the printed wiring board further comprises at least one of: a lithographic technique; a photoetching technique; a plating technique; and a technique used in semiconductor fabrication.

### Claim 13 (depends on 1)

The optical device of claim 1 wherein the light source is a light emitting diode.

### Claim 14 (depends on 1)

The optical device of claim 1, wherein the optical structure is at least one: of a reflective surface; and light shield; and a lens.
