Light emitting diode package structure
AssigneeProlight Opto Technology Corporation
InventorsChen-Lun HSING CHEN, Jung-Hao HUNG, Ding-Yao LIN
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Abstract
A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit.
Claims12
A light emitting diode package structure, comprising:
- at least one light emitting diode unit;
- an encapsulating body comprising a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed;
- and
- at least one isolation film formed on the exposed surfaces;
- wherein the isolation blocks or reflects a portion of light emitted from the light emitting diode unit.
Dependencies are inferred from the claim text.