Semiconductor Device and Method of Manufacturing the Same
AssigneeSanken Electric Co., Ltd.
InventorsHiroko Kawaguchi, Hiromichi Kumakura, Satoru Washiya, Toru Yoshie
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AssigneeSanken Electric Co., Ltd.
InventorsHiroko Kawaguchi, Hiromichi Kumakura, Satoru Washiya, Toru Yoshie
Estimating the term…
A semiconductor device having a main electrode connected to a first semiconductor region and a second semiconductor layer on a semiconductor substrate so that a pn-junction diode is formed with the first semiconductor region being interposed and a Schottky barrier diode is formed with the second semiconductor layer being interposed on a surface of the semiconductor substrate, the semiconductor device includes a first electrode configured to ohmic-contact the first semiconductor region; a second electrode configured to Schottky-contact the second semiconductor layer and not having a portion directly contacting the first electrode; and a conductive reaction suppression layer to suppress a reaction between a material configuring the first electrode and a material configuring the second electrode are provided on the surface of the semiconductor substrate, and the main electrode is electrically connected to the first electrode and the second electrode.
A semiconductor device comprising:
Dependencies are inferred from the claim text.