Soldering Apparatus and Manufacturing Method of Soldered Product

A soldering apparatus, comprising:

• a thermal radiation heater configured to heat a workpiece to be soldered by thermal radiation;
• and
• two coolers configured to cool the workpiece soldered, the coolers being arranged to sandwich the thermal radiation heater therebetween, movable between a standby position and a cooling position, and formed with a recessed portion, the recessed portion configured to dispose therein the thermal radiation heater sandwiched between the two coolers;
• wherein the coolers are configured to be moved to the standby position where the coolers are separated from the workpiece and stand by such that the thermal radiation heater is in a state of protruding from the recessed portion while the thermal radiation heater heats the workpiece, and the coolers are configured to be moved from the standby position to the cooling position to cool the workpiece.