Laser cutting device and method
AssigneeLG Chem, Ltd.
InventorsJin Ho BAN, Chang Bum AHN, Ki Hong MIN, Ji Won PARK, Myung Hoon KO, Seung Ho NA
Life of this patent
Estimating the term…
Loading patent…
AssigneeLG Chem, Ltd.
InventorsJin Ho BAN, Chang Bum AHN, Ki Hong MIN, Ji Won PARK, Myung Hoon KO, Seung Ho NA
Estimating the term…
Provided is a laser cutting device and method which changes a cutting speed of a laser according to a difference between characteristics (absorption coefficients) of an object to be cut, so as to uniformly supply an energy of laser to the whole of the object, thereby preventing the object from being incompletely cut. A laser cutting device includes a database that stores information about a cutting pattern, a moving part that changes a location of a laser beam emitted to an object to be cut, a characteristic value input part that receives speed information from a user according to locations on the cutting pattern, and a control part that adjusts a moving speed of the laser beam by controlling the moving part according to the speed information from the characteristic value input part, and the information about the cutting pattern from the data base.
A laser cutting device comprising:
A laser cutting device comprising:
A laser cutting method for a laser cutting device, comprising:
Dependencies are inferred from the claim text.