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US 2015/0090477 A1Published application
Multilayer structure, fingerprint identification device and manufacturing method thereof
AssigneeInnolux Corporation
InventorsYi-Xin YANG, Din-Guo CHEN
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Abstract
A multilayer structure comprises an insulation material, a conductive layer and a protective film. The conductive layer is disposed on the insulation material. The protective film is disposed on the surface of the conductive layer, and the surface area of the protective film is less than that of the conductive layer. A fingerprint identification device and a manufacturing method thereof are also disclosed.
Claims10
A multilayer structure, comprising:
- an insulation material;
- a conductive layer disposed on the insulation material;
- and
- a protective film disposed on the surface of conductive layer, wherein the surface area of the protective film is less than that of the conductive layer, wherein the protective film comprises diamond-like carbon.
1 more element
A fingerprint identification device, comprising:
- a substrate;
- a fingerprint sensing circuit disposed on the substrate;
- an insulation material disposed on the fingerprint sensing circuit;
- a conductive layer disposed on the insulation material;
- and
- a protective film disposed on the surface of the conductive layer, wherein the surface area of the protective film is less than that of the conductive layer,
- wherein the protective film comprises diamond-like carbon.
4 more elements
A manufacturing method of a multilayer structure, comprising steps of:
- providing an insulation material;
- forming a conductive layer on the insulation material;
- fixing a mask on the conductive layer, the mask including a plurality of openings;
- applying a bias to the mask and depositing a protective film on the surfaces of the conductive layer respectively corresponding to the openings, wherein the protective film comprises diamond-like carbon;
- and
- removing the mask.
3 more elements
Dependencies are inferred from the claim text.