Thermal shield sheet

Abstract

A method of reducing heat in an electronic device includes providing a housing, providing a heat generating component and positioning a heat reduction sheet between the housing and the heat generating component. The heat reduction sheet includes a substrate, a first porous layer and a second porous layer. Each of the substrate and first and second porous layers has a first main surface and a second main surface. The first porous layer has an average cavity diameter of between approximately 0.01 μm and approximately 10 μm. The second porous layer has an average cavity diameter of between approximately 0.01 μm and approximately 10 μm. At least a portion of the first main surface of the substrate is in contact with at least part of the first main surface of the first porous layer. At least a portion of the second main surface of the substrate is in contact with at least part of the first main surface of the second porous layer.

Dependencies are inferred from the claim text.