Novel electrodes for etch
AssigneeApplied Materials, Inc.
InventorsBanqiu Wu, Saravjeet Singh, Amitabh Sabharwal, Ajay Kumar
Life of this patent
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Abstract
An electrode having a first portion and a second portion is formed over a substrate to couple to a bias RF power. The first portion is configured to compensate for an electric field at the second portion to even out a distribution of an etching strength over a workpiece placed over the electrode.
Claims20
An apparatus to etch a workpiece comprising:
- a supporting substrate;
- and
- a first electrode layer comprising a first portion and a second portion over the supporting substrate to couple to a bias RF power, wherein the first portion is configured to compensate for an electric field at the second portion to even out a distribution of an etching strength over the workpiece.
A method to manufacture an electrode to etch a workpiece, comprising:
- depositing a first electrode layer over a substrate to couple to a bias RF power, wherein the first electrode layer has a first portion and a second portion, the first portion configured to compensate for an electric field at the second portion to even out a distribution of an etching strength over the workpiece.
The method of claim 11, wherein at least one of the first portion and the second portion comprises a ring.
The method of claim 11, wherein the first portion and the second portion are separated by a distance.
A system to manufacture an electronic device, comprising:
- a chamber;
- an electrode coupled to the chamber to provide a bias RF power to a workpiece, the electrode having a first portion and a second portion, wherein the first portion is configured to compensate for an electric field at the second portion to even out a distribution of an etching strength over the workpiece;
- and a processor coupled to control the bias RF power supplied to the electrode.
The system of claim 20, wherein at least one of the at least one of the first portion and the second portion comprises a ring.
The system of claim 20, wherein the first portion and the second portion are separated by a distance, and wherein the processor is configured to adjust at least one of a frequency, a phase, and the power supplied to the portions.
The system of claim 20, wherein at least one of the first portion and the second portion comprises an opening.
The system of claim 20, wherein at least one of the first portion and the second portion is used to adjust the etching strength of a portion of the workpiece.
Dependencies are inferred from the claim text.