Chip-resistant film
AssigneeNichiban Co., Ltd.
InventorsSyuji ICHIMURA, Masataka SUDO, Tomohisa KATO
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Abstract
A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.
Claims10
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A method of improving the chip resistance of an object comprised of applying a chip resistant film to an object, the chip-resistant film comprising a composite substrate and a pressure-sensitive adhesive, the composite substrate comprising (A) an ionomer layer and (B) a polyolefin-based polymer layer adjacent the ionomer layer, the film having a strength at the upper yield point of 10 to 40 N/10 mm, wherein the pressure-sensitive adhesive is in direct contact with a side of the polyolefin-based polymer layer of the composite substrate that is opposite the ionomer layer.
Dependencies are inferred from the claim text.