Printed circuit board assembly methods

A method comprising:

• aligning a first portion of a magnetic core with respect to a first side of a printed circuit board (PCB) using a first alignment device;
• applying a first bonding material to the first portion of the magnetic core;
• applying a second bonding material to a surface of at least one of the first portion of the magnetic core and a second portion of the magnetic core;
• coupling a second alignment device that retains the second portion of the magnetic core to the first alignment device, wherein, when the first alignment device and the second alignment device are coupled, the first portion and the second portion of the magnetic core are retained in a specified assembly position, the specified assembly position including a specified gap between the first portion and the second portion of the magnetic core;
• and
• curing the first bonding material and the second bonding material.

A method comprising:

• aligning a first portion of a magnetic core with respect to a first side of a printed circuit board (PCB) using a first alignment device, wherein the first alignment device includes a first moveable member to retain the first portion of the magnetic core;
• applying a first bonding material to a surface of at least one of the first portion of the magnetic core and a second portion of the magnetic core;
• coupling a second alignment device that retains the second portion of the magnetic core to the first alignment device, wherein, when the first alignment device and the second alignment device are coupled, the first portion and the second portion of the magnetic core are retained in a specified assembly position, the specified assembly position including a specified gap between the first portion and the second portion of the magnetic core, and wherein the second alignment device comprises a second moveable member to retain the second portion of the magnetic core;
• and
• curing the first bonding material.