Soldering flux and solder paste composition

A solder paste composition comprising:

• a solder alloy powder;
• and
• a soldering flux comprising:
• a base resin;
• an activator containing an acrylic resin having an acid value of not more than 50 mg KOH/g and represented by a general formula (1)
• wherein a monomer weight ratio of a, b, and c is b/(a+b+c)≧0.6, at least one of a and c may be 0, R1 is an alkyl group having a carbon number of 8 to 24, R2 is a substituent other than the R1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R3, R4, and R5 are hydrogen atoms or methyl groups;
• and
• a solvent containing a compound having a carboxyl group in a cyclohexyl skeleton and represented by a general formula (2)
• wherein, R6 is a hydrogen atom or a methyl group, X is any one of a carboxyl group, an alkyl group, and a cyclic structure bonded with an alkylene group (a single or a plurality of rings may be formed, and partially unsaturated bond, a carboxyl group, a carboxylic anhydride group, a halogen group, an aromatic ring, and an amino group may be contained), X may be one of the above substituents or a combination of a plurality of substituents, and X may contain a halogen group or an amino group and an alkylated amino group as substituents.