Substrate processing apparatus and substrate processing method
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsTomonori FUJIWARA, Nobuyuki SHIBAYAMA, Yukifumi YOSHIDA
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Abstract
A substrate processing apparatus includes a substrate holder, and a discharge head for peripheral area from which a fluid is discharge toward a surface peripheral area of the substrate held on the substrate holder. The discharge head for peripheral area includes multiple nozzles, and a support part that supports the nozzles integrally. The nozzles include a processing liquid nozzle from which a processing liquid is discharged toward the surface peripheral area, and a gas nozzle from which gas is discharged toward the surface peripheral area. The gas nozzle is placed upstream of a rotative direction of the substrate relative to the processing liquid nozzle.
Claims21
A substrate processing apparatus comprising:
- a substrate holder to hold a substrate in a horizontal posture, said substrate holder rotating said substrate about a vertical rotary axis passing through the center of a plane of said substrate;
- and
- a discharge head for peripheral area from which a fluid is discharge toward a surface peripheral area of said substrate held on said substrate holder,
- said discharge head for peripheral area including:
- multiple nozzles;
- and
- a support part that supports said nozzles integrally,
- said nozzles including:
- a processing liquid nozzle from which a processing liquid is discharged toward said surface peripheral area;
- and
- a gas nozzle from which gas is discharged toward said surface peripheral area,
- said gas nozzle being placed upstream of a rotative direction of said substrate relative to said processing liquid nozzle.
A substrate processing method comprising the steps of:
- a) rotating a substrate about a vertical rotary axis passing through the center of a plane of said substrate while holding said substrate in a horizontal posture;
- b) discharging a processing liquid from a processing liquid nozzle toward a surface peripheral area of said rotated substrate;
- and
- c) discharging gas from a gas nozzle toward said surface peripheral area, said gas nozzle being placed upstream of a rotative direction of said substrate relative to said processing liquid nozzle, said step c) being performed parallel to said step b).
A substrate processing method comprising the steps of:
- a) discharging a first processing liquid toward a surface peripheral area of a substrate while rotating said substrate about a vertical rotary axis passing through the center of a plane of said substrate;
- b) after discharge of said first processing liquid is stopped, moving said first processing liquid remaining on said surface peripheral area toward an end face of said substrate and shaking off said first processing liquid from said end face toward the outside of said substrate;
- and
- c) discharging a second processing liquid toward said surface peripheral area while rotating said substrate, said step c) being performed after said step b).
Dependencies are inferred from the claim text.