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US 2015/0090087 A1Published application
Aqueous wire slicing fluids and related methods of slicing
AssigneeSaint-Gobain Ceramics & Plastics, Inc.
InventorsJason Alexander Sherlock, Douglas E. Ward, Chun Lung Kuan
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Abstract
An aqueous coolant fluid for cutting or machining a semiconductor substrate, comprising at least one organic phosphorous containing acid or salt thereof, at least one polyol; and at least one surfactant, and a method of cutting a silicon ingot or wafer using the coolant fluid.
Claims20
An aqueous coolant fluid for cutting or machining a substrate, comprising:
- at least one organic phosphorous containing acid or salt thereof in an amount of 0.01 wt % to 10 wt % based on the total weight of the coolant fluid;
- at least one polyol in an amount of at least 15 wt % based on the total weight of the coolant fluid;
- and
- at least one surfactant,
- wherein a weight ratio of the organic phosphorous containing acid to the at least one surfactant is from about 10:1 to about 1:10.
2 more elements
A liquid concentrate adaptable for dilution with a water-based diluent to obtain a coolant fluid, the liquid concentrate comprising:
- at least one organic phosphorous containing acid or salt thereof in an amount of 0.02 wt % to 30 wt % based on the total weight of the liquid concentrate;
- at least one polyol in an amount of 30 wt % to 90 wt % based on the total weight of the liquid concentrate;
- and
- at least one surfactant,
- wherein a weight ratio of the organic phosphorous containing acid to the at least one surfactant is from about 10:1 to about 1:10.
2 more elements
A method of cutting a substrate, comprising
- providing a coolant fluid containing an organic phosphorous containing acid compound or salt thereof in an amount of 0.1 to 10 wt %;
- at least one polyol in an amount of at least 15 wt %;
- and at least one surfactant in an amount of 0.01 to 10.0 wt % based on the total weight of the coolant fluid, wherein a pH value of the fluid is not higher than about 7;
- and
- cutting the substrate with a saw.
2 more elements
Dependencies are inferred from the claim text.