Pressure Sensor Package with Integrated Sealing

A pressure sensor package, comprising:

• a lead;
• a semiconductor die spaced apart from the lead and comprising a terminal and a diaphragm disposed at a first side of the die, the die configured to change an electrical parameter responsive to a pressure difference across the diaphragm;
• an electrical conductor connecting the terminal to the lead;
• a molding compound encasing the electrical conductor, the die and part of the lead;
• and
• a cavity in the molding compound exposing the diaphragm,
• wherein the molding compound has a ridge protruding from a side of the molding compound with the cavity, the ridge surrounding the cavity to form a sealing ring.

A method of manufacturing a pressure sensor package, the method comprising:

• providing a semiconductor die and a lead spaced apart from one another, the die comprising a terminal and a diaphragm disposed at a first side of the die, the terminal connected to the lead by an electrical conductor, the die configured to change an electrical parameter responsive to a pressure difference across the diaphragm;
• encasing the electrical conductor, the die and part of the lead with a molding compound;
• forming a cavity in the molding compound that exposes the diaphragm;
• and
• forming a sealing ring on a side of the molding compound with the cavity, the sealing ring surrounding the cavity and having a lower elastic modulus than the molding compound.