Bending die having surface microstructures and bending punch thereof
AssigneeNational Kaohsiung First University of Science and Technology
InventorsBor-Tsuen LIN, Chun-Chih KUO
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AssigneeNational Kaohsiung First University of Science and Technology
InventorsBor-Tsuen LIN, Chun-Chih KUO
Estimating the term…
Provided are a bending die having surface microstructures and a bending punch thereof applicable to stamping processing to bend a blank to form a shape. The bending die includes a lower die, an upper die, and a workpiece placing piece. The lower die includes a die, and the die includes a forming surface. The upper die includes a bending punch, the bending punch stamps a blank placed on the die in a back and forth stroke, and the bending punch includes a working portion coming into contact with the blank during stamping. The workpiece placing piece is disposed between the upper die and the lower die and used to position or/and press the blank placed on the die. A plurality of microstructures are disposed on the forming surface and/or on the surface of the working portion.
A bending die having surface microstructures, applicable to stamping processing to bend a blank to form a shape, the bending die comprising:
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A bending punch, comprising a working portion in contact with a blank, and surfaces around the working portion comprising a plurality of microstructures, wherein the plurality of the microstructures are in the pattern of a plurality of grooves or a plurality of concaves or a combination of a plurality of grooves and a plurality of concaves, wherein the plurality of grooves of the microstructures are arranged intersecting each other or parallel to each other.
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Dependencies are inferred from the claim text.