Chip joining by induction heating
AssigneeInternational Business Machines Corporation
InventorsStephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan
Life of this patent
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Abstract
Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.
Claims20
A method for joining a chip with a substrate, the method comprising:
- moving the chip with a pick-and-place machine in a motion path from a first location to a second location proximate to the substrate over a first time;
- in response to moving the chip from the first location to the second location, liquefying a plurality of solder bumps carried on the chip over a second time that is less than the first time;
- and
- while the solder bumps are liquefied, placing the chip onto the substrate with the pick-and-place machine.
An apparatus for joining a chip with a substrate, the apparatus comprising:
- a pick-and-place machine including a pick-up head configured to releasably hold the chip and a robotic arm configured to move the pick-up head;
- and
- an induction heater located in a motion path of the chip to the substrate and configured to heat solder bumps on the chip by electromagnetic induction while the chip is releasably held by the pick-up head.
Dependencies are inferred from the claim text.