Multilayer pads and methods of manufacture employing thermal bonding
OwnerJames M. Woods, Marilyn S. Woodsinventors
Life of this patent
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Abstract
In-line methods for manufacturing a plurality of multilayer pads and the resultant pads. Various embodiments of the invention employ one or two thermal bonding stations, such as ultrasonic bonding stations, along with handle folding tooling, to produce two- or three-layer pads in various configurations, without the use of adhesive. Following bonding and handle folding, a cutter, such as a die cutter, is employed to cut through the layers to form individual pads. Pads of various configurations are manufactured, including pads with “L”-shaped handles, handles of “wing” configuration, and “folded” handles.
Claims13
A multilayer pad comprising:
- an absorbent base pad layer having an applying/wiping surface, an attachment surface opposite said applying/wiping surface, and an outer periphery;
- a barrier layer having a lower surface attached by fusing to said base pad layer attachment surface, an upper surface, and an outer periphery coextensive with said outer periphery of said base pad layer;
- a handle including an attached portion fused to a portion of said barrier layer upper surface, and including at least one graspable free portion joined to said handle attached portion along a fold line defining an axis of said multilayer pad;
- and
- said handle attached portion being attached to said barrier layer upper surface along at least one bond line parallel to the pad axis.
A multilayer pad comprising:
- an absorbent base pad layer having an applying/wiping surface, an attachment surface opposite said applying/wiping surface, and an outer periphery;
- a barrier layer having a lower surface attached by fusing to said base pad layer attachment surface, an upper surface, and an outer periphery coextensive with said outer periphery of said base pad layer;
- a handle including an attached portion fused to a portion of said barrier layer upper surface, and including at least one graspable free portion joined to said handle attached portion along a fold line defining an axis of said multilayer pad;
- and
- said handle attached portion being attached to said barrier layer upper surface and said barrier layer lower surface being attached to said base pad layer attachment surface along bond lines parallel to the pad axis.
A multilayer pad comprising:
- an absorbent base pad layer having an applying/wiping surface, an attachment surface opposite said applying/wiping surface, and an outer periphery;
- a barrier layer having a lower surface attached by fusing to said base pad layer attachment surface, an upper surface, and an outer periphery coextensive with said outer periphery of said base pad layer;
- a handle including an attached portion fused to a portion of said barrier layer upper surface, and including at least one graspable free portion joined to said handle attached portion along a fold line defining an axis of said multilayer pad;
- said barrier layer being continuously fused to said base pad layer;
- and
- said handle attached portion being attached to said barrier layer upper surface along at least one bond line parallel to the pad axis.
Dependencies are inferred from the claim text.