Providing A Consolidated Sideband Communication Channel Between Devices

A system comprising:

• a system on a chip (SoC) including:
• a plurality of cores;
• a transaction layer and a link layer of a load/store communication protocol;
• a first physical unit coupled to the link layer to enable communication via a first physical link, the first physical unit of the load/store communication protocol;
• and
• a second physical unit coupled to the link layer to enable communication via a second physical link, the second physical unit comprising an electrical layer not of the load/store communication protocol and a logical layer to interface the link layer to the electrical layer, the logical layer comprising a link training and status state machine (LTSSM) to perform link training of the second physical link, the logical layer further comprising a mapping logic to map control symbols from a first encoding to a second mapping;
• the first physical link coupled between the SoC and a first transceiver;
• the second physical link coupled between the SoC and the first transceiver;
• the first transceiver coupled to the SoC via the first physical link and the second physical link, the first transceiver comprising:
• a second transaction layer and a second link layer of the load/store communication protocol;
• a third physical unit coupled to the second link layer to enable communication via the first physical link;
• and
• a fourth physical unit coupled to the link layer to enable communication via the second physical link, the fourth physical unit comprising a second electrical layer not of the load/store communication protocol and a second logical layer to interface the second link layer to the second electrical layer;
• an image capture device coupled to the SoC to capture image information;
• and
• a touchscreen display coupled to the SoC.

A computer readable storage medium including code, when manufactured, to cause a system on a chip (SoC) to:

• perform, via a link training and status state machine (LTSSM), link training of a first physical link coupled between the SoC and a device, the LTSSM of a logical layer of a physical unit (PHY) of a low power communication protocol, the logical layer to interface an electrical layer of the PHY to a link layer of a load/store communication protocol;
• support, via the LTSSM, a multi-lane configuration of the first physical link;
• map, via a mapping logic of the logical layer, control symbols from a first encoding to a second mapping;
• and
• communicate between the SoC and the device via a second physical link coupled between the SoC and the device, via a PHY of the load/store communication protocol.