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US 2015/0087145 A1Published application
Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive
AssigneeInfineon Technologies AG
InventorUwe Hoeckele
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Abstract
A chip includes an integrated circuit and a carbonic layer. The carbonic layer includes a graphite-like carbon, wherein a lateral conducting path through the graphite-like carbon electrically connects two circuit elements of the integrated circuit.
Claims11
A method for fabricating a chip comprising an integrated circuit, the method comprising:
- heating a carbonic layer to form a conducting portion of the carbonic layer, wherein a lateral path through the conducting portion connects two circuit elements of the integrated circuit.
Dependencies are inferred from the claim text.