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US 2015/0086775 A1Published application
Soy-based adhesives with improved lower viscosity
AssigneeSolenis Technologies, L.P.
InventorsAnthony J. Allen, Bryan K. Spraul
Life of this patent
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Abstract
The technology is directed towards soy-based adhesive compositions having improved viscosity properties due to the use of soy flour having a particular particle size distribution. These compositions are useful for making lignocellulosic composites or engineered wood products.
Claims14
An aqueous thermosetting binder composition comprising soy flour slurry and optionally a reactive thermosetting resin;
- wherein at least 70% of the particles of the soy flour have a particle size of less than about 30 microns.
A process of producing an aqueous adhesive binder comprising:
- obtaining soy flour slurry, wherein at least 70% of the particles have a particle size of less than about 30 microns;
- and combining the slurry with at least one reactive thermosetting resin.
Dependencies are inferred from the claim text.