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US 2015/0086757 A1Published application
Methods of Patterning a Conductor on a Substrate
Assignee3M Innovative Properties Company
InventorsLijun Zu, Matthew H. Frey
Life of this patent
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Abstract
A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.
Claims6
A two-dimensional self-assembled monolayer (SAM) pattern, comprising:
- a low density region measuring at least 5 square millimeters and comprising a two-dimensional mesh of first SAM features having an average area density value of first SAM features between 0.5% to 20%, wherein the first SAM features have a width value between 0.5 to 25 micrometers, a distance value between adjacent first SAM features of less than 1 millimeter;
- and
- a second SAM feature measuring at least 50 micrometers in width, wherein for a junction formed between the first SAM features and the second SAM feature, the first SAM features width is widened by tapering before making contact to the second SAM feature.
Dependencies are inferred from the claim text.