Method for producing a substrate with stacked deposition layers

An apparatus for producing a substrate with stacked deposition layers, comprising:

• an injector head device comprising
• first and second deposition spaces connected to first and second precursor gas supplies, in use, arranged opposite and facing respective opposite sides of a substrate and arranged to contact the substrate surfaces with a first precursor gas from the first precursor supply;
• and contacting the substrate surfaces with a second precursor gas from the second precursor supply;
• the first and second deposition spaces in use being bounded by the injector head and the substrate surface;
• first and second reactant spaces, oppositely arranged and in use, facing respective opposite sides of a substrate and arranged to contact any of the substrate surfaces with at least one of a reactant gas, a plasma, laser-generated radiation, and ultraviolet radiation, for reacting the precursor after deposition of the precursor gas on at least part of the substrate surface;
• the first and second reactant spaces in use being bounded by the substrate surface;
• and
• a gas bearing pressure arrangement arranged for injecting a bearing gas between the injector head and the substrate surface, so that the substrate is balanced supportless by said gas bearing pressure arrangement in said printing head device;
• a pressure control system arranged to selectively supply any of the first and second precursor supplies of said first and second deposition spaces;
• and to selectively supply any of the reactant gas, plasma, laser-generated radiation, and/or ultraviolet radiation, in any or both reactant spaces;
• wherein the pressure control system is further arranged to supply first and second precursor gases at least in one of the iterations simultaneously on opposite substrate surfaces;
• and
• a conveying system arranged to provide relative movement of the substrate and the injector head along a plane of the substrate to form a conveying plane along which the substrate is conveyed between first and second deposition spaces and first and second reactant spaces.