Method of processing a substrate
AssigneesInterface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
InventorsHung-Chieh Lu, Yen-Heng Huang, Chung-Kai Chen, Shih-Chieh Huang, Li-Ting Cheng, Chun-Lin Tseng, Ho-Chieh Tseng, Chiou-Chi Chen, Chang-Kuei Huang, Wei-Chung Chuang
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Abstract
A method of processing a substrate or panel is disclosed. A substrate having thereon an array of chips is provided. A mask layer is laminated on the substrate. The mask layer has a plurality of openings to reveal active areas of the chips respectively. A spray-coating process is then performed to form an adhesive film in the active areas. The mask layer is then stripped off.
Claims12
A method of processing a substrate, comprising:
- providing a substrate having thereon a plurality of chips;
- laminating a mask layer on the substrate, wherein the mask layer has a plurality of openings to reveal active areas of the chips respectively;
- performing a spray-coating process to form an adhesive film in the active areas;
- and
- stripping the mask layer off.
Dependencies are inferred from the claim text.