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US 2015/0086154 A1Published application
Overvoltage protection component and an assembly of integrated circuit chips having said overvoltage protection component
AssigneeSTMicroelectronics S.r.l.
InventorPascal Fonteneau
Life of this patent
Estimating the term…
Abstract
A device includes integrated circuit chips mounted on one another. At least one component for protecting elements of a second chip is formed in a first chip. The chips may be of the SOI type, with the first chip including a first SOI layer having a first thickness and the second chip including a second SOI layer having a second thickness smaller than the first thickness. The first chip including the component for protecting may include an optical waveguide with the component for protecting formed adjacent the optical waveguide.
Claims16
A device, comprising:
- an insulating layer;
- a silicon layer on said insulating layer;
- an optical waveguide formed in said silicon layer by a first region of said silicon layer doped with a first conductivity type and laterally delimited by two outside insulating regions extending completely through the silicon layer, the optical waveguide further defined by an upper insulating layer positioned between the outside insulating regions;
- and
- a protection circuit comprising a second region of said silicon layer doped with a second conductivity type positioned adjacent and in contact with the first region and a third region of said silicon layer more heavily doped with said second conductivity type positioned above and in contact with said second region;
- wherein the third region is insulated from the first region by said upper insulating layer and is further positioned between said upper insulating layer and one of the two outside insulating regions.
3 more elements
A device, comprising:
- a plurality of integrated circuit chips mounted on one another,
- wherein an integrated circuit on a first chip of said plurality of integrated circuit chips includes an optoelectronic component;
- wherein an integrated circuit on a second chip of said plurality of integrated circuit chips includes an electric circuit component;
- wherein said first chip comprises a first silicon on insulator (SOI) layer having a first thickness;
- wherein said second chip comprises a second SOI layer having a second thickness less than said first thickness;
- said first chip further including at least one component configured to protect elements of at least one second chip.
3 more elements
Dependencies are inferred from the claim text.