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US 2015/0086050 A1Published application
Chip with a Micro-Electromechanical Structure and Covering Element, and a Method for the Production of Same
AssigneeRobert Bosch GmbH
InventorAndo Feyh
Life of this patent
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Abstract
A micro-electromechanical chip includes a substrate, a micro-electromechanical structure formed in the substrate, and a covering element that is positioned on a surface of the substrate and that is configured to protect the micro-electromechanical structure from at least one of outside contaminants and mechanical influences.
Claims13
A microelectromechanical chip, comprising:
- a substrate;
- a microelectromechanical structure formed in the substrate;
- and
- a covering element disposed on a surface of the substrate and configured to protect the microelectromechanical structure from at least one of contaminants and mechanical influences from outside.
1 more element
A chip package, comprising:
- a microelectromechanical chip that includes
- a substrate;
- a microelectromechanical structure formed in the substrate;
- and
- a covering element positioned on a surface of the substrate and configured to protect the microelectromechanical structure from at least one of contaminants and mechanical influences from outside;
- and
- a control chip coupled to the microelectromechanical chip and configured to drive the microelectromechanical chip.
4 more elements
A method for producing a microelectromechanical chip, comprising:
- providing a multiplicity of microelectromechanical structures on a wafer;
- applying a covering element layer on the multiplicity of microelectromechanical structures on the wafer;
- and
- singulating the multiplicity of microelectromechanical structures into a plurality of microelectromechanical chips respectively having a microelectromechanical structure covered by a covering element, from the covering element layer, that is disposed on a surface of each of the plurality of microelectromechanical chips.
1 more element
Dependencies are inferred from the claim text.