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US 2015/0085555 A1Published application
Packaged memory dies that share a chip select line
OwnerDavid G. Carpenter, Reza M. Bacchus +1inventors
InventorsDavid G. Carpenter, Reza M. Bacchus, William C. Hallowell
Life of this patent
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Abstract
An apparatus includes a memory module, and the memory module includes a package. The package contains memory dies, and the memory dies share a chip select line.
Claims15
An apparatus, comprising:
- a memory module, comprising:
- a package;
- and
- memory dies contained in the package;
- wherein the memory dies share a chip select line.
2 more elements
A system, comprising:
- a package;
- a first memory die contained in the package;
- and
- a second memory die contained in the package;
- wherein the first memory die and second memory die do not share data lines.
2 more elements
A system, comprising:
- a dual in-line memory module (“DIM”), comprising:
- a package designed to receive one 8-bit memory die;
- and
- two 4-bit memory dies contained in the package, the two memory dies sharing a chip select line.
1 more element
Dependencies are inferred from the claim text.