Electromagnetic interference shielding material, electromagnetic interference shielding device, method for making the electromagnetic interference shielding device, electromagnetic interference shielding package module and appliance

Abstract

The present invention relates to an EMI shielding material that has a mixture that constitutes 70 wt % to 98 wt % of the EMI shielding material, wherein the mixture has: 1) a dendritic copper filler having copper dendritic crystals of lengths ranging from 0.1 μm to 50 μm, 2) a flaky copper filler having copper flakes of diameters ranging from 0.1 μm to 50 μm, 3) a resin binder, and 4) a diluent. The present invention also relates to an EMI shielding device made by applying the EMI shielding material on a surface of an electronic unit and by a following heating. The EMI shielding device has a volume resistivity of 10−5 to 10−3 acm. The invention also provides a method for making the EMI shielding device, a package module employing the foregoing EMI shielding device for shielding electromagnetic interference and an appliance employing the foregoing EMI shielding device.

Dependencies are inferred from the claim text.