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US 2015/0085456 A1Published application
Imprinted multi-level micro-wire circuit structure
OwnerRonald Steven Cokinventor
Life of this patent
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Abstract
An imprinted multi-level micro-wire structure includes a substrate and a first layer formed over the substrate. The first layer includes first micro-wires formed in first micro-channels imprinted in the first layer. A second layer is formed in contact with the first layer. The second layer includes second micro-wires formed in second micro-channels imprinted in the second layer. At least one of the second micro-wires is in electrical contact with at least one of the first micro-wires.
Claims21
An imprinted multi-level micro-wire structure, comprising:
- a substrate;
- a first layer formed over the substrate, the first layer including first micro-wires formed in first micro-channels imprinted in the first layer;
- a second layer formed in contact with the first layer, the second layer including second micro-wires formed in second micro-channels imprinted in the second layer;
- and
- wherein at least one of the second micro-wires is in electrical contact with at least one of the first micro-wires.
2 more elements
Dependencies are inferred from the claim text.