Electronic component-embedded substrate and manufacturing method thereof

An electronic component-embedded substrate, comprising:

• a core substrate;
• a cavity formed in the core substrate and comprising a first embedding space, which is one of two or more embedding spaces and is formed in a horizontal rectangular, when viewed on the plane, a connecting space, which is connected to a portion of a lower long side of the first embedding space, of which one side, when viewed on the plane, forming a connecting width coincides with one short side of the first embedding space and the other side (when viewed on the plane) meets the lower long side of the first embedding space, and a second embedding space which is formed in a horizontal rectangular shape, when viewed on the plane, and has the other short side coinciding with the other side, when viewed on the plane, of the connecting space and an upper long side meeting the one side, when viewed on the plane, of the connecting space;
• two or more electronic components maximally rotatable at a point at which a side of the connecting space and a long side of the embedding space meet each other and separately accommodated in the embedding spaces of the cavity, respectively, so as not to contact each other at the time of being maximally rotated;
• and
• upper and lower insulating layers covering the electronic components embedded in the cavity and having a plurality of vias formed therein so as to be electrically connected to the electronic components while penetrating through at least one thereof.

A manufacturing method of an electronic component-embedded substrate, the manufacturing method comprising:

• forming a cavity, in a core substrate, configured that two or more embedding spaces having a rectangular shape, when viewed on the plane, are connected to each other by a connecting space so that neighboring long sides of first and second embedding spaces are partially connected to each other by the connecting space and one side, when viewed on the plane, forming a connecting width of the connecting space connecting the first and second embedding spaces coincides with one short side of the first embedding space and the other side, when viewed on the plane, coincides with the other short side of the second embedding space;
• separately inserting two or more electronic components into the embedding spaces of the cavity, respectively;
• and
• covering the cavity into which the electronic components are inserted with an insulating layer(s) and forming a plurality of vias electrically connected to the electronic components while penetrating through the insulating layer.