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US 2015/0085446 A1Published application
Substrate, chip arrangement, and method for manufacturing the same
AssigneeInfineon Technologies AG
InventorsWolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt
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Abstract
In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.
Claims20
A substrate comprising:
- a ceramic carrier comprising a first side and a second side opposite the first side;
- a first metal layer disposed over the first side of the ceramic carrier;
- a second metal layer disposed over the second side of the ceramic carrier;
- and
- a cooling structure formed into or over the second metal layer.
2 more elements
A chip arrangement comprising:
- a substrate, comprising:
- a ceramic carrier comprising a first side and a second side opposite the first side;
- a first metal layer disposed over the first side of the ceramic carrier;
- a second metal layer disposed over the second side of the ceramic carrier;
- and
- a cooling structure formed into or over the second metal layer;
- and
- a chip coupled to the first side of the substrate, wherein the chip is electrically coupled to the first metal layer of the substrate.
5 more elements
A method for forming a chip arrangement, comprising:
- forming a substrate, comprising:
- forming a ceramic carrier comprising a first side and a second side opposite the first side;
- forming a first metal layer over the first side of the ceramic carrier;
- forming a second metal layer over the second side of the ceramic carrier;
- and
- forming a cooling structure into the second metal layer;
- and
- forming a chip coupled to the first side of the substrate, wherein the chip is electrically coupled to the first metal layer of the substrate.
5 more elements
Dependencies are inferred from the claim text.