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US 2015/0085442 A1Published application
Computer provided with cooling system
AssigneeHitachi, Ltd.
InventorsYoshihiro Kondo, Takayuki Fujimoto, Fumio Takeda, Takeshi Kato
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AssigneeHitachi, Ltd.
InventorsYoshihiro Kondo, Takayuki Fujimoto, Fumio Takeda, Takeshi Kato
Estimating the term…
The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.
A computer provided with a cooling system and equipped with a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted, the computer comprising:
Dependencies are inferred from the claim text.