Double sided flex for improved bump interconnect
AssigneeXerox Corporation
InventorPeter J. Nystrom
Life of this patent
Estimating the term…
Abstract
A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead.
Claims20
A printhead, comprising:
- a dielectric substrate comprising a first side and a second side opposite the first side;
- a plurality of first active traces on the first side of the dielectric substrate;
- a plurality of embossed first flex circuit pads on the first side of the dielectric substrate;
- and
- a plurality of embossed second flex circuit pads on the second side of the dielectric substrate,
- wherein at least a portion of each embossed second flex circuit pad directly overlies a corresponding first flex circuit pad.
A printer, comprising:
- a printhead, comprising:
- a dielectric substrate comprising a first side and a second side opposite the first side;
- a plurality of first active traces on the first side of the dielectric substrate;
- a plurality of embossed first flex circuit pads on the first side of the dielectric substrate;
- and
- a plurality of embossed second flex circuit pads on the second side of the dielectric substrate,
- wherein at least a portion of each embossed second flex circuit pad directly overlies a corresponding first flex circuit pad;
- and
- a printer housing that encases the printhead.
A method for forming a printhead, comprising:
- forming a first plurality of first active traces on a first side of a dielectric substrate;
- forming a plurality of first flex circuit pads on the first side of the dielectric substrate;
- forming a second plurality of second active traces on a second side of the dielectric substrate that is opposite to the first side;
- forming a plurality of second flex circuit pads on the second side of the dielectric substrate, wherein at least a portion of each embossed second flex circuit pad directly overlies a corresponding first flex circuit pad;
- embossing the plurality of first flex circuit pads to form a plurality of embossed flex circuit pads;
- and
- embossing the plurality of second flex circuit pads to form a plurality of embossed second flex circuit pads.
Dependencies are inferred from the claim text.