Contact arrangements and methods for detecting incorrect mechanical contacting of contact structures
AssigneeInfineon Technologies AG
InventorsWolfgang Horn, Mario Wiesner
Life of this patent
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Abstract
A contact arrangement is provided, including a contact structure and a sense structure. The sense structure may be arranged in proximity of the contact structure. The sense structure may be configured such that a correct mechanical contacting of the contact structure will not impact the sense structure and an incorrect mechanical contacting of the contact structure will impact the sense structure.
Claims30
A contact arrangement, comprising:
- a contact structure;
- a sense structure arranged in proximity of the contact structure and configured such that
- a correct mechanical contacting of the contact structure will not impact the sense structure;
- and
- an incorrect mechanical contacting of the contact structure will impact the sense structure.
A method for detecting an incorrect mechanical contacting of a contact structure, comprising:
- arranging at least one sense structure in proximity of the contact structure such that an incorrect mechanical contacting of the contact structure will impact the sense structure and a correct mechanical contacting of the contact structure will not impact the sense structure;
- mechanical contacting the contact structure;
- and
- measuring at least one of
- an electric voltage between the contact structure and the sense structure;
- an electric current flowing between the contact structure and the sense structure;
- a resistance between the contact structure and the sense structure;
- and
- a resistance of the sense structure.
A method for detecting a misalignment of a wire bond with respect to a bond pad, comprising:
- arranging at least one conducting sense structure in proximity of the bond pad such that a misaligned wire bond will contact both the sense structure and the bond pad and an aligned wire bond will not contact the sense structure;
- wire bonding the bond pad;
- and
- measuring at least one of
- an electric voltage between the bond pad and the sense structure;
- an electric current flowing between the bond pad and the sense structure;
- and
- a resistance between the bond pad and the sense structure.
Dependencies are inferred from the claim text.