Imprinted micro-wire circuit multi-level stamp method

A method of making a multi-level micro-wire structure, comprising:

• forming a curable first layer over a substrate and imprinting a first pattern of first micro-channels in the first layer with a first stamp;
• curing the curable first layer to form a cured first layer having the first micro-pattern of first micro-channels imprinted in the cured first layer;
• locating a curable conductive ink in the first micro-channels and curing the curable conductive ink to form first micro-wires in the first micro-channels;
• forming a curable second layer in contact with the cured first layer and imprinting a second micro-pattern of second micro-channels in the second layer with a multi-level second stamp different from the first stamp, wherein at least one of the second micro-channels is a multi-level second micro-channel;
• curing the curable second layer to form a cured second layer having the second micro-pattern of multi-level second micro-channels imprinted in the cured second layer, at least one of the multi-level second micro-channels formed to contact at least one first micro-wire;
• locating a curable conductive ink in the multi-level second micro-channels and curing the curable conductive ink to form multi-level second micro-wires in the multi-level second micro-channels;
• and
• wherein the at least one multi-level second micro-wire is in electrical contact with the at least one first micro-wire.