Copper Ball Bond Features and Structure

An integrated circuit wire bond connection comprising:

• a copper bond wire comprising a copper ball and an aluminum bond pad that is directly bonded to the copper ball to form an aluminum splash structure and associated crevice opening between the aluminum splash structure and copper ball at a peripheral bond edge of the copper ball, where the aluminum splash structure is characterized by a first plurality of geometric features indicative of a reliable copper ball bond comprising:
• a splash height measure of the vertical distance from a top surface of the aluminum bond pad to a top surface of the aluminum splash structure that is less than half a ball bond height measure for the copper ball and more than half an original pad thickness measure for the aluminum bond pad;
• and
• a gap height measure of the vertical distance from a lowest point of the crevice opening to the top surface of the aluminum splash structure that is less than eighty percent of the splash height measure.

An integrated circuit wire bond connection comprising:

• a copper bond wire comprising a copper ball and an aluminum bond pad that is directly bonded to the copper ball to form an aluminum splash structure and associated crevice opening between the aluminum splash structure and copper ball at a peripheral bond edge of the copper ball, where the aluminum splash structure is characterized by a first plurality of geometric features indicative of a reliable copper ball bond, and where the crevice opening between the aluminum splash structure and copper ball is characterized by a second plurality of geometric features comprising:
• a crevice initiation plane intersecting the lowest point of the crevice opening and positioned above a top surface of the aluminum bond pad;
• and
• a crevice mouth width measure and a crevice length measure, where a ratio of the crevice mouth width measure to the crevice length measure is between 0.1 and 0.5.