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US 2015/0084198 A1Published application
Interconnect wires including relatively low resistivity cores
AssigneeIntel Corporation
InventorsHUI JAE YOO, TEJASWI K. INDUKURI, RAMANAN V. CHEBIAM, JAMES S. CLARKE
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Abstract
A dielectric layer and a method of forming thereof. An opening defined in a dielectric layer and a wire deposited within the opening, wherein the wire includes a core material surrounded by a jacket material, wherein the jacket material exhibits a first resistivity ρ1 and the core material exhibits a second resistivity ρ2 and ρ2 is less than ρ1.
Claims22
A method of forming a wire in a dielectric layer, comprising:
- forming a first opening in a dielectric layer;
- depositing a conformal coating of a first layer of a jacket material on said dielectric layer and forming a second opening in said first opening, wherein said jacket material exhibits a first resistivity ρ1;
- depositing a core material on said conformal coating, wherein said core material exhibits a second resistivity ρ2 and ρ2 is less than ρ1;
- reflowing said core material wherein said core material partially fills said second opening;
- and
- depositing a second layer of said jacket material over said core material and said first layer of said jacket material, filling said second opening and forming a wire, wherein said core material is surrounded by said jacket material.
3 more elements
A metallization layer, comprising:
- an opening defined in a dielectric layer;
- and
- a wire within said opening;
- wherein said wire includes a core material surrounded by a jacket material, wherein said jacket material exhibits a first resistivity ρ1 and said core material exhibits a second resistivity ρ2 and ρ2 is less than ρ1.
1 more element
An integrated circuit, comprising:
- one or more dielectric layers;
- a plurality of openings defined in each of said dielectric layers;
- and
- a plurality of wires connected to one or more components associated with said integrated circuit, wherein each wire is positioned within one of said openings and said wires include a core material surrounded by a jacket material, wherein said jacket material exhibits a first resistivity ρ1 and said core material exhibits a second resistivity ρ2 and ρ2 is less than ρ1.
1 more element
Dependencies are inferred from the claim text.