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US 2015/0084194 A1Published application
Package vias for radio frequency antenna connections
AssigneeIntel Corporation
InventorsWolfgang Molzer, Edmund Goetz, Reinhard Mahnkopf, Bernd Memmler
Life of this patent
Estimating the term…
Abstract
Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
Claims18
A package comprising:
- a package substrate;
- a die attached to the package substrate;
- and
- a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
1 more element
A package comprising:
- a die;
- molding compound over the die;
- an antenna over the molding compound;
- and
- a via between the die and the antenna through the molding compound to couple signals between the antenna and the die.
2 more elements
Dependencies are inferred from the claim text.