Tall solders for through-mold interconnect

A method of forming a microelectronic package, comprising:

• forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is configured for coupling the circuit with an integrated circuit above an upper surface of the circuit substrate;
• forming a mold onto an upper surface of the circuit substrate over the circuit of the circuit substrate;
• defining an opening in the mold, the opening extending from a top surface of the mold to at least a portion of the circuit;
• and
• forming solder into the opening, including conforming the solder to the opening and the circuit substrate.

A system, comprising:

• a first microelectronic chip package including a first die situated on an upper surface of a first substrate and a solder ball situated on a lower surface of the first substrate;
• a second microelectronic chip package situated below the lower surface of the first substrate, the second microelectronic package including:
• a second die situated on a top surface of a second substrate,
• a molding disposed over the upper surface of the second substrate, the molding extending over the circuit and including an opening extending from an upper surface of the molding towards an upper surface of the second substrate, wherein the opening is configured to admit at least a portion of the solder ball, and
• a solder column mechanically coupled to the second substrate, situated in the opening, and extending above the upper surface of the second substrate to a height sufficient to electrically couple with the solder ball when the solder ball is at least partially situated in the opening and reflowed;
• and
• a printed circuit board electrically and mechanically coupled to a second solder ball on the lower surface of the second substrate.