Stackable molded microelectronic packages
AssigneeTessera, Inc.
InventorBelgacem Haba
Life of this patent
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Abstract
A microelectronic package has a microelectronic element and conductive posts or masses projecting above a surface of the substrate. Conductive elements at a surface of the substrate opposite therefrom are electrically interconnected with the microelectronic element. An encapsulant overlies at least a portion of the microelectronic element and may be in contact with the conductive posts or masses. The encapsulant may have openings permitting electrical connections with the conductive posts or masses. The openings may partially expose conductive masses joined to posts, fully expose top surfaces of posts and partially expose edge surfaces of posts, or may partially expose top surfaces of posts.
Claims1
A microelectronic package comprising:
- a substrate having a first surface and a second surface remote from the first surface;
- a microelectronic element overlying the first surface;
- substantially rigid conductive posts projecting above at least one of the first or second surfaces, the conductive posts having top surfaces remote from the substrate and edge surfaces extending away from the top surfaces;
- conductive elements exposed at a surface of the substrate opposite the surface above which the conductive posts project, the conductive elements being electrically interconnected with the microelectronic element;
- and
- an encapsulant overlying at least a portion of the microelectronic element and the surface of the substrate above which the conductive posts project, the encapsulant having a plurality of openings each exposing the top surface and partially exposing the edge surface of at least one of the conductive posts, wherein at least some of the conductive posts are electrically insulated from one another and adapted to simultaneously carry different electric potentials.
Dependencies are inferred from the claim text.