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US 2015/0084186 A1Published application
Bump structure having a single side recess
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Horng CHANG, Tin-Hao KUO, Chen-Shien CHEN, Yen-Liang LIN
Life of this patent
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Abstract
A bump structure includes a first end, and a second end opposite the first end. The bump structure further includes a first side connected between the first end and the second end. The bump structure further includes a second side opposite the first side. The second side is connected between the first end and the second end, and the second side comprises a recess for a reflowed solder material to fill.
Claims20
A bump structure comprising:
- a first end;
- a second end opposite the first end;
- a first side connected between the first end and the second end;
- and
- a second side opposite the first side, wherein the second side is connected between the first end and the second end, and the second side comprises a recess for a reflowed solder material to fill.
2 more elements
A semiconductor structure comprising:
- an array of bump structures configured to electrically connect to a separate die, wherein at least one bump structure of the array of bump structures comprises:
- a first end;
- a second end opposite the first end;
- a first side connected between the first end and the second end;
- and
- a second side opposite the first side, wherein the second side is connected between the first end and the second end, and the second side comprises a recess for a reflowed solder material to fill.
3 more elements
An array of bump structures of a semiconductor die comprising:
- a core region having at least one first non-recessed bump structure, wherein the core region is located in a central portion of the semiconductor die;
- a corner region having at least one second non-recessed bump structure, wherein the corner region is located at a corner of the semiconductor die;
- and
- a recess peripheral region having at least one recessed bump structure, wherein the recess peripheral region is located at an edge of the semiconductor die adjacent to the corner region, and the at least one recessed bump structure comprises:
- a side having a recess for a reflowed solder material to fill.
2 more elements
Dependencies are inferred from the claim text.