Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

A semiconductor device comprising:

• a bottom substrate comprising a top surface and a bottom surface;
• a semiconductor die comprising a top surface and a bottom surface, wherein the bottom surface of the semiconductor die is bonded to the top surface of the bottom substrate;
• an extended substrate comprising a top surface and a bottom surface;
• an adhering member bonding the bottom surface of the extended substrate to the top surface of the semiconductor die;
• and
• at least one conductive bump bonding the bottom surface of the extended substrate to the top surface of the bottom substrate.

A method for manufacturing a semiconductor device, the method comprising:

• bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, the top surface of the bottom substrate comprising a conductive bump;
• encapsulating the semiconductor die and the conductive bump utilizing a mold member;
• thinning the mold member to expose a top surface of the semiconductor die and a top of the conductive bump;
• forming an adhering member on the top surface of the semiconductor die;
• and
• bonding a bottom surface of an extended substrate to the semiconductor die utilizing the adhering member and to the bottom substrate utilizing the exposed conductive bump.