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US 2015/0084181 A1Published application
3DIC Package Comprising Perforated Foil Sheet
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorWensen Hung
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Abstract
A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material. An upper layer of the thermal interface material is overlying the PFS, and a lower layer of thermal interface material is underlying the PFS. The thermal interface material fills through-openings in the PFS.
Claims20
A structure comprising:
- an integrated circuit package;
- a thermal interface material over the integrated circuit package;
- and
- a Perforated Foil Sheet (PFS) over the thermal interface material, wherein the PFS comprises through-openings therein, with a first portion of the PFS embedded in the thermal interface material.
1 more element
A structure comprising:
- a device die;
- a Perforated Foil Sheet (PFS) comprising a first portion, wherein the PFS comprises a through-opening in the first portion;
- and
- a thermal interface material comprising:
- a first portion filling the through-opening;
- and
- a second portion between and contacting a back surface of the device die and the PFS.
4 more elements
A method comprising:
- dispensing a first thermal interface material over a device die;
- and
- placing a first portion of a Perforated Foil Sheet (PFS) overlying the first thermal interface material, wherein the PFS comprises a through-opening therein, and a portion of the first thermal interface material is exposed through the through-opening.
Dependencies are inferred from the claim text.