Integrated circuit packaging system with heat spreader and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsOh Han Kim, SeIl Jung, HeeSoo Lee, Jae Han Chung, YoungChul Kim
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Abstract
An integrated circuit packaging system, and method of manufacture therefor, includes: a substrate; a mold cap formed on the substrate; fiducial mark inscribed in the mold cap; a thermal interface material applied over the substrate and referenced by the fiducial mark; and a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
- forming a mold cap, on the substrate;
- inscribing a fiducial mark in the mold cap;
- positioning a thermal interface material, applied over the substrate, referenced by the fiducial mark;
- and
- mounting a heat spreader, on the thermal interface material, precisely positioned by aligning a position notch relative to the fiducial mark.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate, having a component side;
- forming a mold cap, on the component side of the substrate;
- inscribing a fiducial mark in the mold cap;
- positioning a thermal interface material referenced by the fiducial mark including applying a measured shape;
- and
- mounting a heat spreader, on the thermal interface material, precisely positioned by aligning a position notch relative to the fiducial mark including compressing the measured shape between the heat spreader and the mold cap.
An integrated circuit packaging system comprising:
- a substrate;
- a mold cap formed on the substrate;
- a fiducial mark inscribed in the mold cap;
- a thermal interface material applied over the substrate and referenced by the fiducial mark;
- and
- a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.
Dependencies are inferred from the claim text.