Semiconductor device leadframe
AssigneeNXP B.V.
InventorsFreek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
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Abstract
For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
Claims15
A lead frame for a semiconductor device manufactured by film assisted moulding, the lead frame comprising:
- a connection lead, the connection lead comprising a connection portion for electrical connection to a semiconductor die, wherein an edge of said connection portion comprises a recessed portion wherein the recessed portion is arranged to seal against a film during moulding of the semiconductor device.
Dependencies are inferred from the claim text.