Semiconductor device leadframe
AssigneeNXP B.V.
InventorsFreek Egbert van Straten, Jeremy Joy Montalbo Incomio, Albertus Reijs
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Abstract
For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
Claims15
A lead frame for a semiconductor device manufactured by film assisted moulding, the lead frame comprising:
- a base portion;
- and a connection lead,
- wherein the base portion comprises an upper surface arranged for mounting one or more semiconductor device dies,
- wherein the connection lead comprises a portion arranged horizontally with respect to the upper surface of the base portion for external connection and an angled tip portion for connection to the semiconductor die, and
- wherein the angled portion is arranged to seal against a film during moulding of the semiconductor device.
Dependencies are inferred from the claim text.