Integrated circuit packaging system with side solderable leads and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Emmanuel Espiritu, Allan P. Ilagan, Marites Laguipo Roque
Life of this patent
Estimating the term…
Abstract
A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a leadframe having a side solderable lead with a half-etched lead portion and a lead top side;
- forming a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body;
- removing a portion of the mold body and a portion of the side solderable lead for forming a mold groove in the mold body to expose a lead protrusion of the side solderable lead on an upper perimeter side of the mold body;
- and
- singulating the mold body and the leadframe for exposing the half-etched lead portion from a lower perimeter side of the mold body.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a leadframe having a die paddle and a side solderable lead with a half-etched lead portion and a lead top side;
- forming a mold body directly on the leadframe, the die paddle, and the side solderable lead with the lead top side of the side solderable lead exposed from the mold body;
- removing a portion of the mold body and a portion of the side solderable lead using laser ablation for forming a mold groove in the mold body to expose a lead protrusion of the side solderable lead on an upper perimeter side of the mold body;
- and
- singulating the mold body and the leadframe for exposing the half-etched lead portion from a lower perimeter side of the mold body.
An integrated circuit packaging system comprising:
- a leadframe having a side solderable lead with a half-etched lead portion and a lead top side;
- a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body;
- a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body;
- and
- the half-etched lead portion exposed from a lower perimeter side of the mold body.
Dependencies are inferred from the claim text.