Stacked microelectronic dice embedded in a microelectronic substrate

A method of forming a microelectronic device, comprising:

• attaching at least one first microelectronic die to a second microelectronic die with a plurality of interconnects;
• disposing an underfill material between the at least one first microelectronic die and the second microelectronic die after attachment;
• positioning a first laminate layer proximate the at least one first microelectronic die;
• positioning a second laminate layer proximate the second microelectronic die;
• and
• bringing pressure to bear on the first laminate layer and the second laminate layer to form a microelectronic substrate embedding the at least one first microelectronic die and the second microelectronic die therein.

A method of forming a microelectronic device, comprising:

• disposing an underfill material on the at least one of a first microelectronic die and the second microelectronic die;
• attaching at least one first microelectronic die to a second microelectronic die with a plurality of interconnects extending though the underfill material;
• positioning a first laminate layer proximate the at least one first microelectronic die;
• positioning a second laminate layer proximate the second microelectronic die;
• and
• bringing pressure to bear on the first laminate layer and the second laminate layer to form a microelectronic substrate embedding the at least one first microelectronic die and the second microelectronic die therein.