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US 2015/0084150 A1Published application
Ball grid array packaged camera device soldered to a substrate
AssigneeDelphi Technologies, Inc.
InventorsBINGHUA PAN, YEW KWANG LOW, SIM YING YONG
Life of this patent
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Abstract
An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.
Claims8
An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate, said assembly comprising:
- a spacer between the device and the substrate, said spacer configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls, wherein the spacer comprises one of solder mask, tape, and legend ink.
Dependencies are inferred from the claim text.