Low Profile Sensor Package With Cooling Feature And Method Of Making Same
AssigneeOptiz, Inc.
InventorsVage Oganesian, Zhenhua Lu
Life of this patent
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Abstract
A sensor device and method of making same that includes a silicon substrate with opposing first and second surfaces, a sensor formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor, and a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface. The cooling channels instead can be formed on one or more separate substrates that are attached to the silicon substrate for cooling the silicon substrate.
Claims27
A sensor device, comprising:
- a silicon substrate with opposing first and second surfaces;
- a sensor formed at or in the first surface;
- a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor;
- and
- a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface.
A sensor device, comprising:
- a silicon substrate with opposing first and second surfaces;
- a sensor formed at or in the first surface;
- a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor;
- a second substrate with opposing first and second surfaces, wherein the second surface of the silicon substrate is mounted to the first surface of the second substrate;
- and
- a plurality of cooling channels formed as first trenches extending into one of the first and second surfaces of the second substrate but not reaching the other of the first and second surfaces of the second substrate.
A method of forming a sensor device, comprising:
- providing a silicon substrate with opposing first and second surfaces;
- forming a sensor at or in the first surface;
- forming a plurality of first contact pads at the first surface which are electrically coupled to the sensor;
- and
- forming a plurality of cooling channels as first trenches extending into the second surface but not reaching the first surface.
A method of forming a sensor device, comprising:
- providing a silicon substrate with opposing first and second surfaces;
- forming a sensor at or in the first surface;
- forming a plurality of first contact pads at the first surface which are electrically coupled to the sensor;
- providing a second substrate with opposing first and second surfaces;
- forming a plurality of cooling channels as first trenches extending into one of the first and second surfaces of the second substrate but not reaching the other of the first and second surfaces of the second substrate;
- and
- mounting the second surface of the silicon substrate to the first surface of the second substrate.
Dependencies are inferred from the claim text.