Image pickup module and method for manufacturing image pickup module
AssigneeSharp Kabushiki Kaisha
InventorNaoki Sakota
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Abstract
The present invention achieves reduction in size and thickness while removing the cause of defective image and the like. According to an image pickup module (1), a solid-state image pickup device (3) and a flexible substrate (2) are connected to each other by flip-chip bonding, and an opening (5) is formed in the flexible substrate 2 by melting the flexible substrate (2) and an anisotropically-conductive film (8) adhered to the flexible substrate (2).
Claims8
An image pickup module comprising:
- a solid-state image pickup device having a light receiving section and an electrode pad;
- a substrate having an opening, a wiring pattern which is connected to the electrode pad by flip-chip bonding being formed on the substrate;
- an anisotropically-conductive film which is adhered to the substrate so that the substrate and the solid-state image pickup device are connected to each other via the anisotropically-conductive film;
- and
- a light-transmitting member provided in the opening, the light-transmitting member causing light to pass through so that the light is to be received by the light receiving section,
- the opening being formed by melting the substrate and the anisotropically-conductive film, and
- at an edge of the opening, the anisotropically-conductive film being hardened while retaining a melted shape which has been formed by the melting.
The image pickup module as set forth in a wherein an interface between the substrate and the solid-state image pickup device is sealed by resin.
A method for manufacturing an image pickup module in which a solid-state image pickup device having an electrode pad is provided on a substrate on which a wiring pattern is formed, said method comprising the steps of:
- (a) adhering an anisotropically-conductive film to the substrate;
- (b) forming an opening by melting a periphery of a part to be cut out of the substrate to which the anisotropically-conductive film has been adhered;
- (c) providing a light-transmitting member in the opening;
- and
- (d) connecting, by flip-chip bonding, the wiring pattern of the substrate to the electrode pad of the solid-state image pickup device via a bump such that a light receiving section of the solid-state image pickup device receives light which has passed through the light-transmitting member.
Dependencies are inferred from the claim text.